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Fine-Blend® took part in the 2018 CHINAPLAS

2018-05-04 15:30:19   Source:    Views:

2018 CHINAPLAS has been held in Shanghai on April 24-27, 2018.

Fine-Blend® took part in the exhibition at National Exhibition and Convention Center, Hongqiao, Shanghai (NECC). In this exhibition,Fine-Blend showed its feature products: SAG-002, CMG5701, SOG-02, and EMI-230B.

From the first day of the exhibition, Fine-Blend booth(4.2H R59) welcomed new and old customers from all over the world, and communicate with each other.

 

 

 



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